Joining Technology for the Improved Solar Cell Module ManufacturingCX(s) Applied: B3.6Date: 03/14/2011Location(s): West Chester, PennsylvaniaOffice(s): Energy Efficiency and Renewable Energy, National Energy Technology Laboratory
Office of NEPA Policy and Compliance
March 14, 2011CX(s) Applied: B3.6
Date: 03/14/2011
Location(s): West Chester, Pennsylvania
Office(s): Energy Efficiency and Renewable Energy, National Energy Technology Laboratory
Make lab ?test? coupons joining copper interconnects to silicon solar cell backs using the S-Bond, thermosonically activated process. Electrical characteristics of interconnects, performance evaluation of joints.