Sound Assisted Low Temperature Spalling for Low Cost Silicon Modules Award Number: DE-EE0007367 CX(s) Applied: A9, B3.6 Solar Energy Technologies Office Date: 4/8/2016 Location(s): AZ Office(s): Golden Field Office
Office of NEPA Policy and Compliance
June 11, 2016
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Sound Assisted Low Temperature Spalling for Low Cost Silicon Modules
Award Number: DE-EE0007367
CX(s) Applied: A9, B3.6
Solar Energy Technologies Office
Date: 4/8/2016
Location(s): AZ
Office(s): Golden Field Office
The U.S. Department of Energy (DOE) is proposing to provide federal funding to Arizona State University (ASU) to develop a new method for cutting silicon wafers that eliminates slurry and wires, while doubling the yield of a silicon ingot by engineering the spalling process using acoustic waves and low temperatures.
The proposed project activities would include the design and testing of a novel method to section silicon wafers by precisely engineering the applied stress and controlling of the fracture front. Design and testing of this system would occur in a research laboratory at ASU.