Printed Circuit Board Through-Hole Plating, Masking, and Legending ProcessCX(s) Applied: B3.6Date: 10/12/2011Location(s): Aiken, South CarolinaOffice(s): Environmental Management, National Energy Technology Laboratory
Office of NEPA Policy and Compliance
October 12, 2011
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Printed Circuit Board Through-Hole Plating, Masking, and Legending Process
CX(s) Applied: B3.6
Date: 10/12/2011
Location(s): Aiken, South Carolina
Office(s): Environmental Management, National Energy Technology Laboratory
A MiniContac RS electrochemical plater is used to plate through-holes with copper between surface layers on electronic printed circuit boards. Additionally, a ProMask (solder mask) process and ProLegend (legend printing or silkscreening) are used to process the printed circuit boards. All equipment and chemical supplies are procured from LPKF Laser & Electronics.
CX(s) Applied: B3.6
Date: 10/12/2011
Location(s): Aiken, South Carolina
Office(s): Environmental Management, National Energy Technology Laboratory
A MiniContac RS electrochemical plater is used to plate through-holes with copper between surface layers on electronic printed circuit boards. Additionally, a ProMask (solder mask) process and ProLegend (legend printing or silkscreening) are used to process the printed circuit boards. All equipment and chemical supplies are procured from LPKF Laser & Electronics.