Next-Generation LED Package Architectures Enabled by Thermally Conductive Transparent Encapsulants

Lead Performer: Momentive Performance Materials Quartz Inc.
DOE Total Funding: $1,497,255
Cost Share: $512,700
Project Term: October 1, 2014 - September 30, 2016
Funding Opportunity: SSL R&D Funding Opportunity Announcement (FOA) (DE-FOA-0000973)

Project Objective

This project will develop next-generation LED package architectures enabled by thermally conductive composite encapsulant materials utilizing boron nitride (BN). Nanoscale boron nitride enables high thermal conductivity encapsulants that maintain optical properties. The high thermal conductivity encapsulants facilitate higher drive current (and therefore higher lumen output) at the same operating temperature and same device cost.

Contacts

DOE Technology Manager: Jim Brodrick
Lead Performer: Momentive