Printed Circuit Board Through-Hole Plating, Masking, and Legending Process CX(s) Applied: B3.6 Date: 05/22/2012 Location(s): South Carolina Offices(s): Savannah River Operations Office
Office of NEPA Policy and Compliance
May 22, 2012
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Printed Circuit Board Through-Hole Plating, Masking, and Legending Process
CX(s) Applied: B3.6
Date: 05/22/2012
Location(s): South Carolina
Offices(s): Savannah River Operations Office
A MiniContac RS electrochemical plater is used to plate through-holes with copper between surface layers on electronic printed circuit boards . Additionally, a ProMask (solder mask) process and ProLegend (legend printing or silkscreening) are used to process the printed circuit boards. All equipment and chemical supplies are procured from LPKF Laser & Electronics.
CX(s) Applied: B3.6
Date: 05/22/2012
Location(s): South Carolina
Offices(s): Savannah River Operations Office
A MiniContac RS electrochemical plater is used to plate through-holes with copper between surface layers on electronic printed circuit boards . Additionally, a ProMask (solder mask) process and ProLegend (legend printing or silkscreening) are used to process the printed circuit boards. All equipment and chemical supplies are procured from LPKF Laser & Electronics.