CX-270806: University of Nebraska, Lincoln - Lateral-scaling Orthogonal-cooling Packages for Next-generation MVAC-LVDC Distribution Infrastructure (LincolnPak)

Funding will support the project team's small-scale research and development of a scalable package for quasi-two-level super switches, designed for efficient high-voltage, high-frequency alternating current (AC) to direct current (DC) conversion.

Office of NEPA Policy and Compliance

August 5, 2025
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Funding will support the project team's small-scale research and development of a scalable package for quasi-two-level super switches, designed for efficient high-voltage, high-frequency alternating current (AC) to direct current (DC) conversion. Specifically, the project team will (1) design, model, and develop the lateral-scaling orthogonal-cooling package, (2) test, validate, and optimize the package system, (3) design, model, and develop the switching system, (4) test, validate, and optimize switching system, and (5) combine components, test, and validate the full Lateral-scaling Orthogonal-cooling Packages for Next-generation MVAC-LVDC Distribution Infrastructure (LincolnPak) system to meet final concept standards. If successful, this project will result in a LincolnPak system that leverages American-made SiC power devices, with 60 percent lower power loss, twice the power density, and 50 percent cost savings, for use in grid infrastructure, fusion, CO2 methanation, and defense applications, meeting the growing needs of rising domestic energy use and thereby increasing U.S. energy security.