The new high-power LED is a die-on-ceramic surface-mountable LED package. It has four 2mm2 InGaN pump dice, flip-chip attached to a ceramic submount in a 2x2 array configuration. The submount design combines a high-thermal-conductivity ceramic core for die attachment and a low-cost, low-thermal-conductivity ceramic frame for mechanical support and carrying the optical lens. The LED package has a thermal resistance of approximately 1.25 kelvin per watt.
The efficacy performance goal was achieved through progress in high-efficiency royal blue pump LED development, thanks to active region design and epitaxial growth quality improvement. Improvement in extraction efficiency from the LED package was achieved by improving InGaN-die-level and package-level optical extraction efficiency. Phosphor system efficiency was improved by improving phosphor-package interactions.
The high-power warm-white LED product developed has been proven to have good reliability through extensive reliability tests.
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