Lead Performer: Lumileds, LLC – San Jose, CA
DOE Total Funding: $1,890,891
Cost Share: $1,890,892
Project Term: August 1, 2013 – November 30, 2015
Funding Opportunity: SSL Manufacturing R&D Funding Opportunity Announcement (FOA) DE-FOA-000079
The objective of this project is to reduce LED manufacturing costs by establishing a patterned sapphire substrate fabrication process with demonstrated epitaxial growth of indium gallium nitride (InGaN) layers capable of producing high-efficiency LEDs when combined with chip-on-board packaging techniques. The proposed cost reductions would result from the elimination of some of the complex processes associated with current flip-chip technology, and from the enabling of lower-cost packaging methods that take advantage of the stability of the sapphire substrate, which is removed in a standard flip-chip device.
This approach has the potential to reduce the cost of high-brightness LED lamps and modules targeted across a wide range of lighting and illumination applications. This project looks to address the needs of the indoor and outdoor illumination markets, which demand the most competitive Lm/W and Lm/$ characteristics in small footprint components.
DOE Technology Manager: Jim Brodrick
Lead Performer: Joseph Flemish, Lumileds, LLC