SAFI-Tech proposes to develop a new form factor for soldering metal alloy SnAg3.0Cu0.5 ,SAC305, used to create conductive interconnects when mounting thin, high-density, high-energy particle detectors onto substrates.
SAFI-Tech proposes to develop a new form factor for soldering metal alloy SnAg3.0Cu0.5 ,SAC305, used to create conductive interconnects when mounting thin, high-density, high-energy particle detectors onto substrates.