Lead Performer: Eaton Corporation – Menomonee Falls, WI
  -   Heraeus Materials Technology, LLC – Conshohocken, PA
  -   Haiku Tech Inc – Miami, FL
  -   Eaton Cooper Lighting Innovation Center – Peachtree City, GA
DOE Total Funding: $2,468,672
Cost Share: $2,468,676
Project Term: September 15, 2013 – June 30, 2016
Funding Opportunity: SSL Manufacturing R&D Funding Opportunity Announcement (FOA) DE-FOA-0000792

Project Objective

The objective of the project is to develop a new low-cost, high-efficiency LED architecture made possible by novel large-area parallel processing technologies, reduced number of fabrication steps, and minimized raw materials use. This new scheme will result in an ultra-compact chip-level package (CLP) architecture with simultaneously high efficacy and high color quality, which will benefit luminaire platforms ranging from bulbs to troffers. A direct chip-to-system solder-attach geometry will enable LED electrical integration into systems regardless of circuit carrier type or material, leading to luminaires that have superior optical and thermal performance at simultaneously reduced fabrication cost.

The benefits of a thick-film process include increased automation, manufacturing flexibility, reduced lead time, and inventory simplification. Replacing the metal-core printed circuit board and thermal interface material with a printed circuit on the luminaire reduces the number of thermal interfaces in the system and thus improves thermal resistance while lowering manual assembly costs. In addition, an integrated driver circuit provides an optimal level of integration, facilitates full automation of electronics component assembly, and significantly reduces material costs.

Project Impact

Pilot-scale results include an optimized process that to date has reduced the number of process steps by 33% and has cut total process time by almost 50%. Thermal shock reliability analysis indicates that the design parameters have a significant effect on the lifetime, but accelerated life-testing has been used to validate a number of configurations that are competitive with the most robust LED luminaire products. The project’s ultimate goal is a fivefold reduction in process time and a 2.5-fold reduction in the number of process steps, while tripling manufacturing throughput. It is projected that the combined impact of material cost-out and manufacturing integration and optimization could reduce the integrated light engine price from $50/klm at the project’s inception to less than $4/klm.


DOE Technology Manager: Jim Brodrick
Lead Performer: Sridhar R. Nimma, EATON Corporation

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