AMO Virtual Workshop Series on Semiconductor R&D for Energy Efficiency: Advanced Packaging for Energy Efficient Microelectronics, January 12-13 and 19-20, 2022, 12:30-3:30 p.m. Join AMO for a webinar to discuss emerging tech and opportunities for overcoming key barriers in advanced packaging and improving energy efficiency of 3D microelectronics.

The U.S. Department of Energy’s (DOE’s) Office of Energy Efficiency and Renewable Energy (EERE) Advanced Manufacturing Office (AMO) will host the fourth in its series of workshops focused on semiconductor R&D for energy efficiency in January 2022.

Since 2010, semiconductor energy use has doubled every three years. By 2030, semiconductors could consume nearly 20% of planetary energy production. Hence, innovation in semiconductor energy efficiency is essential for the economy, jobs, and to address the climate crisis. 

This workshop will discuss the trends, drivers, and challenges for three critical energy-related topics for advanced packaging of 3D microelectronics:

  • Thermal management
  • I/O and interconnects
  • Metrology

This workshop will be split into two segments: a webinar from January 12–13, 2022 and a roundtable tentatively set for January 19–202022.

The input gathered during this workshop will help inform the research focus areas considered by AMO in fulfilling its mission to improve energy efficiency and decarbonize manufacturing industries significantly by 2030.